ENCAPSULATION PRESSES

ENCAPSULATION PRESSES

These high precision hydraulic encapsulation presses are built for moulding integrated circuit chips. The press configurations range from 25 tons to 200 tons each with 2 to 8 chases for each run of IC chips. Zicom had supplied this presses to worldwide chips maker such as Intel, Motorola, Micron, SG Thomson, Kemet, Amcor and many others leaders of these industries.